Precision Engineering for Advanced Failure Analysis

The global standard in microelectronics & high-tech equipment. We are the only company worldwide mastering all 4 ways of IC decapsulation: LASER, ACID, MECHANICAL, and PLASMA.

25+

Years of Innovation

4

Decapsulation Methods

Global

Industry Recognition

100%

In-house Engineering

Mastering the Science of Decapsulation

For over 25 years, Digit Concept has provided Failure Analysis laboratories with cutting-edge equipment, support, and services of the highest quality.

As a specialized Fabless company and via our DC Engineering subsidiary, we don't just distribute equipment; we innovate. We invest considerable time and effort into improving existing technologies and developing patented solutions, like our Atmospheric Plasma Assisted technology, to meet the evolving needs of the semiconductor industry.

We remain the only company worldwide with deep, practical expertise across all four pillars of IC decapsulation.

View Our Technologies
4 Ways of Decapsulation: Laser, Acid, Mechanical, Plasma

The Four Pillars of Decapsulation

Comprehensive solutions tailored to your specific IC materials, wire types, and analytical requirements.

Sesame LASER

High-performance IR Fiber LASER systems for precise ablation and cross-sectioning. Clean, fast, and highly controllable.

Sesame PLASMA

Patented Atmospheric Plasma Assisted technology. The ultimate solution to prevent corrosion on sensitive Cu, Ag, and Cu/Pd wires.

Sesame ACID

Automated Mixed Acid decapsulators delivering precise micro-aliquots with specific pressure for delicate packages and copper structures.

Sesame MECHANICAL

Dedicated systems like the SM441DC, providing the simplest and most effective way to mechanically decapsulate specific package types.

High-Performance Equipment

Discover our flagship engineering solutions designed to accelerate and perfect your failure analysis workflows.

SLP500DC Equipment
Sesame LASER PLASMA

SLP500 Platform

The benchmark for Quality/Price ratio. The Green way to decapsulate all types of ICs, combining IR Fiber LASER with Atmospheric Plasma Assisted technology.

  • 3-in-1: Decapsulation, PCB cutting, Cross-sectioning
  • Prevents corrosion on sensitive wires (Cu, Ag)
  • 10W IR Fiber LASER base (upgradable)
  • Compact, 110/220V plug-and-play
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SLP1000 Equipment
Sesame LASER PLASMA

SLP1000 System

High performance 20W IR LASER operating within a wide chamber. Designed for maximum capabilities and large-scale analytical demands.

  • 20W Ytterbium doped Fiber LASER
  • 254mm Lens with 170x170mm marking area
  • Real-time vision & Easy Focus
  • High grade programmable X-Y table options
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SLP1000UG Upgrade
Upgrades & Acid Systems

System Upgrades & SA777

Breathe new life into your old equipment with our UG kits, or explore the SA777—the first automated mixed acid decapsulator specifically made for copper.

  • SLP1000UG: Upgrade old Sesame1000 on site
  • Integrates new Atmospheric PLASMA
  • SA777: +10°C to +250°C operations
  • No sample damage micro-aliquot delivery
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Mission-Critical Defence Solutions

We understand that in the defence sector, failure analysis requires absolute precision, security, and reliability. Digit-Concept provides tailored, high-tech decapsulation equipment meeting the rigorous standards of military and aerospace applications.

Discuss Defence Requirements

Partner With Us

Have a specific challenge or need to upgrade your laboratory? Share your requirements with our engineering team.

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Global Operations

Serving laboratories across AMERICA, ASIA, and EUROPE.

Training Provider: Activity declaration number 28 14 03108 14.